Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM

Allwinner T113-i Cortex-A7 ARM Embedded SoM

No.SoM330 Series
SoM330 series is a compact System-on Module (SoM) based on Allwinner T113-i industrial processor with a 1.2GHz Dual-core Cortex-A7 CPU, Optional 128M/256M/512M/1GByte DDR3, 256Mbyte NAND Flash or 4/8GByte eMMC
CPU
Allwinner T113-i, 2xARM Cortex-A7, clock speed up to 1.2GHz
RAM
128M/256M/512M/1GByte DDR3
ROM
256Mbyte NAND Flash or 4/8GByte eMMC
Model:
SoM330
Description

The SOM330 series is a fully domestic industrial core board based on the Allwinner Technology T113-i heterogeneous multi-core processor, featuring a dual-core ARM Cortex-A7, Xuartie C906 RISC-V, and HiFi4 DSP. The ARM Cortex-A7 processing unit operates at up to 1.2 GHz. All components, including the CPU, ROM, RAM, power supply, and crystal oscillator, are domestically produced industrial-grade solutions, achieving a 100% localization rate.

The core board uses stamp-hole connections to provide interfaces such as CAN, UART, SPI, TWI (I2C), EMAC, USB, LVDS DISPLAY, RGB DISPLAY, MIPI DSI, CVBS IN/OUT, and CSI. It supports hardware video encoding for 1080P@60fps JPEG/MJPEG and hardware decoding for 4K@30fps H.265 and 4K@24fps H.264. The board has undergone professional PCB layout and high/low-temperature testing, ensuring stable and reliable quality to meet various industrial application requirements.

The SOM330 series supports operating systems such as Linux-4.9.170, Linux-RT-4.9.170, and Ubuntu 20.04, along with development tools like Docker containers, Node-Red, and Qt-5.12.5 for graphical interface development.

The SOM330 series is designed for reliability and stability through professional electrical performance design and high/low-temperature testing, making it suitable for diverse industrial applications, including industrial IoT, edge computing gateways, photovoltaic power generation and storage systems, automation control, and railway transportation.


Typical Applications

  • IoT Gateways
  • Industrial PLC
  • Industrial HMI
  • Robot Teach Pendants
  • Outdoor Energy Storage EMS/BMS
  • Electric Vehicle Charging Stations
  • Smart Devices


Hardware and Software Specifications

Hardware Block Diagram

Hardware Specifications

Parameter Details
CPU Allwinner T113-i, 22nm process - 2x ARM Cortex-A7, up to 1.2 GHz -
1x HiFi4 DSP, up to 600 MHz 
1x Xuartie C906 RISC-V (64-bit), up to 1008 MHz
Decoder: - H.265 MP@L5.0, up to  
H.264 BP/MP/HP@L5.0, up to 4K@24fps
MPEG-4 SP/ASP L5.0, up to 1080p@60fps
MPEG-2/MPEG-1 MP/HL, up to 1080p@60fps
JPEG/Xvid/Sorenson Spark, up to 1080p@60fps
MJPEG, up to 1080p@30fps
Encoder: JPEG/MJPEG, up to 1080p@60fps
ROM 256 MB NAND Flash or 4/8 GB eMMC
RAM 128 MB / 256 MB / 512 MB / 1 GB DDR3
Stamp Holes 2x 30-pin + 2x 40-pin, total 140 pins, 1.0 mm pitch
LED 1x Power Indicator
2x User-Programmable Indicators
Video IN 1x CSI (CMOS sensor parallel interface), 8-bit, supports 1080P@30fps
2x CVBS IN, supports NTSC and PAL formats
Video OUT 2x LVDS DISPLAY (LVDS0, LVDS1), supports 1080P@60fps
1x RGB DISPLAY, supports 1080P@60fps
1x MIPI DSI, 4 data lanes, supports 1200P@60fps
Note: LVDS0, LVDS1, and LCD0 (RGB DISPLAY) share pins; LVDS0 and MIPI DSI share pins
1x CVBS OUT, supports NTSC and PAL formats
Audio 1x Audio Codec: - 3x Mono MIC IN - 1x Stereo LINE IN - 1x Stereo FM IN - 1x Differential LINE OUT - 1x Stereo Headphone OUT
Other Resources 1x USB2.0 DRD (USB0)
1x USB2.0 HOST (USB1)
2x SMHC (SDC0/SDC1), supports SD3.0, SDIO3.0, eMMC5.0 (Note: Onboard eMMC uses SDC2, not available via stamp holes)
4x TWI (TWI0~TWI3, I2C), supports standard (100 Kbps) and high-speed (400 Kbps) modes
1x SPI1, 1 chip select, up to 100 MHz, supports SPI and DBI modes (Note: Onboard NAND Flash uses SPI0, not available via stamp holes; SPI0 and SDC2 share pins)
6x UART (UART0~UART5), supports 4 Mbps baud rate
8x PWM (PWM0~PWM7), supports PWM output/input capture, up to 24/100 MHz
1x EMAC, supports RGMII/RMII (10/100/1000 Mbps)
2x GPADC, 12-bit, up to 1 MHz sampling rate
4x TPADC, 12-bit, up to 1 MHz, supports 4-wire resistive touchscreens
1x LRADC, 6-bit, up to 2 KHz sampling rate
1x LEDC, supports 1024 LEDs in series, up to 800 Kbps
3x I2S/PCM, full-duplex, 8 KHz~384 KHz sampling rate
1x DMIC, supports up to 8 channels, 8 KHz~48 KHz sampling rate
1x OWA (One Wire Audio), compatible with S/PDIF
2x CIR (1x CIR TX, 1x CIR RX)
2x CAN (CAN0, CAN1), supports CAN 2.0A and CAN 2.0B protocols
3x JTAG (ARM, RISC-V, HiFi4 DSP)

Software Specifications

Parameter  Details
Operating Systems Buildroot-2019.02 (Linux-5.4.61, Linux-RT-5.4.61)
Ubuntu 20.04 (Linux-5.4.61, Linux-RT-5.4.61)
OpenWrt (Linux-5.4.61, Linux-RT-5.4.61)
SylixOS (domestic OS, planned)
GUI Development Tools Qt-5.12.5, Qt-5.11.3
Software Development Kits T113-i_V1.0 (Linux), T113_Tina5.0-V1.0 (Linux)
Driver Support
DDR3 eMMC
UART NAND Flash
LED KEY
SD CAN
Ethernet USB
4G/WIFI CVBS IN
RTC MIC IN/LINE IN
H/P OUT LVDS LCS
TFT LCD MIPI LDC/HDMI OUT
CVBS OUR Touch Screen


Development Resources

Hardware Resources:

  • Core board pin definitions, 3D graphics files, editable baseboard schematics, editable baseboard PCB, chip datasheets, and assistance with domestic component selection to reduce hardware design time.

Software Resources:

  • System firmware images, filesystem images, kernel driver source code, and extensive demo programs.
  • Complete platform development kits and introductory tutorials to simplify application development.

Development Examples:

  • Linux, Linux-RT, and Qt application development
  • HiFi4 DSP development
  • RISC-V development
  • Inter-core communication (ARM + HiFi4 DSP/RISC-V)
  • IgH EtherCAT master and CAN development
  • 4G/WIFI/NB-IoT/ZigBee/LoRa development
  • LVDS, LCD, MIPI, HDMI, CVBS multimedia display development
  • H.264, H.265 video development
  • Docker container technology and MQTT communication protocol
  • Ubuntu and OpenWrt OS demonstrations
  • SylixOS (domestic OS) demonstrations (planned)
  • 8/16-channel domestic synchronous AD acquisition (compatible with AD7606/AD7616 pins)
  • ARM and FPGA communication (SPI/CSI)

Note: Some examples may not yet be released. Contact sales for details.


Electrical Characteristics

Operating Conditions

Parameter Min Typical Max
Operating Temperature (Industrial) -40°C - 85°C
Operating Temperature (Wide-Temp) -20°C - 70°C
Operating Voltage - 5.0V -

Power Consumption

State Typical Voltage Typical Current Typical Power
Idle 5.0V 0.12A 0.60W
Full Load 5.0V 0.22A 1.11W


Mechanical Dimensions

Parameter Details
PCB Dimensions 35 mm x 45 mm
PCB Layers 8 layers
PCB Thickness 1.6 mm


Product Ordering Models

Model MCU Frequency Cores NAND Flash eMMC DDR3 Temperature Grade
SOM330 T113-i 1.2 GHz 2x A7 256 MB - 256 MB Industrial (-40~85°C)
SOM331 T113-i 1.2 GHz 2x A7 256 MB - 128 MB Industrial (-40~85°C)
SOM332 T113-i 1.2 GHz 2x A7 - 4 GB 256 MB Industrial (-40~85°C)
SOM333 T113-i 1.2 GHz 2x A7 - 4 GB 512 MB Industrial (-40~85°C)
SOM334 T113-i 1.2 GHz 2x A7 - 8 GB 512 MB Industrial (-40~85°C)
SOM335 T113-i 1.2 GHz 2x A7 - 8 GB 1 GB Industrial (-40~85°C)
SOM336 T113-i 1.2 GHz 2x A7 - 4 GB 256 MB Wide-Temp (-20~70°C)


Core Board Kit Contents

Item Quantity Remarks
SoM330 Core Board 1 -
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM
  • Allwinner T113-i Cortex-A7 ARM Embedded SoM,Allwinner T113-i Cortex-A7 ARM Embedded SoM

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